发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 In one embodiment, a semiconductor device includes a first insulator, and conductors and second insulators alternately provided on the first insulator. Each second insulator of the second insulators has a first side face adjacent to one of the conductors via a first air gap, a second side face adjacent to one of the conductors via a second air gap, first lower faces in contact with the first insulator, and second lower faces provided above the first insulator via third air gaps.
申请公布号 US2016163581(A1) 申请公布日期 2016.06.09
申请号 US201514641718 申请日期 2015.03.09
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 YOSHIDA Kiyomitsu
分类号 H01L21/768;H01L23/532;H01L23/528 主分类号 H01L21/768
代理机构 代理人
主权项 1. A semiconductor device comprising: a first insulator; and conductors and second insulators alternately provided on the first insulator, each second insulator of the second insulators comprising: a first side face adjacent to one of the conductors via a first air gap; a second side face adjacent to one of the conductors via a second air gap; first lower faces in contact with the first insulator; and second lower faces provided above the first insulator via third air gaps.
地址 Minato-ku JP