APPARATUS FOR REMOVING A RING-SHAPED REINFORCEMENT EDGE FROM A GROUND SEMICONDUCTOR WAFER

摘要

An apparatus for removing a ring-shaped reinforcement, edge from a ground semiconductor wafer, which is cohesively connected to an elastic carrier film and is fixed to a circumferential wafer frame via the carrier film, includes a holding device, which has a support having suction openings for holding the semiconductor wafer on the support surface of the support, and a separating device, which includes a device for integrally detaching the reinforcement edge from the carrier film. In order to be able to detach the reinforcement edge from the carrier film without damage, the holder device has a clamping device encompassing the support and serving for clamping the wafer frame and/or the carrier film, wherein the clamping device interacts with the support to stretch the carrier film, and the separating device has a tool guide with a dividing tool for moving the dividing tool between carrier film and reinforcement edge in order to detach the reinforcement edge in one piece from the carrier film stretched by interaction of clamping device and support.

主权项

1. Apparatus for removal of a ring-shaped reinforcement edge (2) from a ground semiconductor wafer (3), which wafer is connected with an elastic film (4) with material fit, and attached to a circumferential wafer frame (11) by way of this carrier film (4), the apparatus having a holding device (7) that has a support (8) having suction openings (9) for holding the semiconductor wafer (3) against the support surface (16) of the support (8), and having a severing device (6) that comprises means for detachment of the reinforcement edge (2) from the carrier film (4) in one piece, wherein the holding device (7) has a clamping device (10) that surrounds the support (8), for clamping the wafer frame (11) and/or the carrier film (4) in place, wherein the clamping device (10) interacts with the support (8) to produce stretching of the carrier film (4), and wherein the severing device (6) has a tool guide (13) having a disaggregating tool (12), for moving the disaggregating tool (12) between carrier film (4) and reinforcement edge (2), in order to detach the reinforcement edge (2) from the carrier film (4), which is stretched by an interaction of clamping device (10) and support (8), in one piece.