Soldering method for joining thin sheet metal

摘要

The method is intended preferably for joining components consisting of thin sheet metal through partial soldering by means of conductive resistance heating and use of powdered solder materials. The powder (1) is loosely placed on one (2) of the components to be joined, or on an electrode (3) with a tapered end section and a flat working surface. By means of conductive resistance heating producing solder sintering, the powder deposit is securely attached to the component for subsequent transport, positioning and joining processes. The apparatus for applying solder deposits from below to component surfaces takes the form of a dished elastic collar which is made of a non-conducting material and is placed around the electrode (3).