发明名称 CIRCUIT MODULE AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To reduce size, by improving the mounting efficiency by building into a multilayer structure and to increase the reliability by having a functional element body operate stably. <P>SOLUTION: The functional element body 5 is sealed in the layer of the multilayered structure of a module board 2 and a wiring board 4 which are stacked via a prepreg 3, in such a manner that a functional surface 5a formed with a movable portion 5b may face a concave portion 6. The functional element body 5 is built in and shielded, between the first shield pattern 12 of the module board 2 and the second shield pattern 18 of the wiring board 4, which are interlayer-connected by a grounding via 19 extending through the prepreg 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006156482(A) 申请公布日期 2006.06.15
申请号 JP20040340928 申请日期 2004.11.25
申请人 SONY CORP 发明人 OYA YOICHI
分类号 H05K3/46;H05K9/00 主分类号 H05K3/46
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