| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To cut a laminate body made of dissimilar materials by a laser beam of single wavelength. <P>SOLUTION: Glass 12 and 16 to transmit the laser forms a silicon substrate 14 and a laminate to absorb the laser. Grooves 13 and 17 to match a cutting line to cut a device chip are formed on a surface to make contact with the silicon substrate 14 of the glass 12 and 16. The laser beam 23 is irradiated on the laminate body 10 while blasting N2 gas 27. The beam 23 is absorbed by the silicon substrate, melted silicon is splashed in the groove 13, and the glass 12 is cut off as the silicon attached in the groove is heated by the laser. The melted silicon is also filled in the groove 17 of the glass 16 through a through hole made on the silicon substrate 14. The glass 16 is cut off as the silicon filled in the groove 17 is heated by the laser. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
