| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of reducing a stress generated by a thermal expansion difference, wherein it is necessary to perform a lower tensional packaging in order to bond an LSI chip to a packaging circuit board and a bonding becomes possible at a low temperature of 100°C or less, preferably at a low temperature of 30°C or less by using a conductor in which there are dispersed metallic particles forming an alloy with Ga at 100°C or less in a metal containing Ga at the time of a solder bonding. <P>SOLUTION: A distance between an electrode 2 provided in electron devices 1 and an electrode 4 provided in a packaging board 3 is bonded by a conductor 5 in which there are dispersed metallic particles 7 responding to the alloy with Ga at 100°C or less in a metal 6 containing Ga. <P>COPYRIGHT: (C)2007,JPO&INPIT |
