| 发明名称 |
IMAGE SENSOR DEVICE WITH SENSING SURFACE CAVITY AND RELATED METHODS |
| 摘要 |
An image sensor device may include an interconnect layer, an image sensor IC carried by the interconnect layer and having an image sensing surface, and encapsulation material laterally surrounding the image sensor IC and covering an upper surface of the image sensor IC up to the image sensing surface. The image sensor device may include an optical plate having a peripheral lower surface carried by an upper surface of the encapsulation material and aligned with the image sensing surface, the optical plate being spaced above the image sensing surface to define an internal cavity, and a lens assembly coupled to the encapsulation material and aligned with the image sensing surface. |
| 申请公布号 |
US2016197113(A1) |
申请公布日期 |
2016.07.07 |
| 申请号 |
US201514589210 |
申请日期 |
2015.01.05 |
| 申请人 |
STMICROELECTRONICS PTE LTD |
发明人 |
WONG Wing Shenq |
| 分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An image sensor device comprising:
an interconnect layer; an image sensor integrated circuit (IC) carried by said interconnect layer and having an image sensing surface; encapsulation material laterally surrounding said image sensor IC and covering an upper surface of said image sensor IC up to said image sensing surface; an optical plate having a peripheral lower surface carried by an upper surface of said encapsulation material and aligned with the image sensing surface, said optical plate being spaced above said image sensing surface to define an internal cavity; and a lens assembly coupled to said encapsulation material and aligned with said image sensing surface. |
| 地址 |
Singapore SG |
