发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can form a gate electrode achieving high shape controllability by multiple patterning while inhibiting erosion of a gate insulation film and a gate electrode.SOLUTION: A semiconductor device manufacturing method comprises: patterning a hard mask formed on a gate film by using a first mask pattern; processing the patterned hard mask film to a gate pattern by using a second mask pattern; patterning the gate film by using the hard mask film as a mask to form a spacer insulation film; forming on the spacer insulation film, a third mask pattern which covers ends of the gate pattern; etching the spacer insulation film by using the third mask pattern as a mask to form sidewall insulation films on sidewall parts of the gate film while remaining the spacer insulation film in regions of the ends of the gate pattern.
申请公布号 JP2014160735(A) 申请公布日期 2014.09.04
申请号 JP20130030321 申请日期 2013.02.19
申请人 FUJITSU SEMICONDUCTOR LTD 发明人 FUKUDA MASATOSHI
分类号 H01L29/78;H01L21/28;H01L21/336;H01L21/8234;H01L27/088;H01L29/423;H01L29/49 主分类号 H01L29/78
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