| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing tape capable of sufficiently suppressing generation of transfer marks onto an adhesive layer.SOLUTION: The wafer processing tape comprises: a release film; the adhesive layer which is provided on a surface of the release film and has a predetermined planar shape; and a viscous film including a label part that is provided in contact with the release film around the adhesive layer and has a predetermined planar shape, and a peripheral part which is provided to surround the outside of the label part. The adhesive layer includes an adhesive layer surface and an adhesive layer side edge that extends from the adhesive layer surface to the release film. The adhesive layer side edge is formed in such a manner that an angle between the adhesive layer surface and the adhesive layer side edge becomes abuse, that the adhesive layer side edge is inclined relatively to the release film and that an angle to the release film becomes 4.0 degrees or more and 84 degrees of less. Otherwise, the adhesive layer includes an adhesive layer surface and an adhesive layer side edge that extends from the adhesive layer surface to the release film while being smoothly curved.SELECTED DRAWING: Figure 1 |
