| 摘要 |
This bonding device 100 is a bonding device that bonds a substrate 12 and an electronic component 14 together by heating, while pressurizing, a pressurization unit 200 including a first transmission member 210 and a second transmission member 220 that sandwich an assembly 10 in which the electronic component 14 is placed on the substrate 12 with a metal particle paste 16 therebetween and that transmit pressure and heat to the assembly, the bonding device comprising: a heating mechanism part 120 including a first heating part 122 and a second heating part 124 that are arranged at positions opposing one another; a positioning mechanism part 130 for positioning the pressurization unit 200 at a position within a space between the first heating part 122 and the second heating part 124 where the pressurization unit contacts neither the first heating part 122 nor the second heating part 124; and a pressurizing mechanism part 140 that pressurizes the pressurization unit 200 by moving the first heating part 122 and/or the second heating part 124. With this bonding device 100, the substrate 12 and the electronic component 14 can be bonded together with high bonding force. |
