发明名称 CONDUCTIVE STRUCTURE AND MANUFACTURING METHOD THEREFOR, ARRAY SUBSTRATE AND DISPLAY DEVICE
摘要 A conductive structure and a manufacturing method therefor, an array substrate and a display device. The conductive structure comprises multiple first metal layers (10) made of aluminum, and a second metal layer (20) is also arranged between every two adjacent first metal layers (10); and the second metal layers (20) are made of metals except the aluminum. The conductive structure can reduce the small bump phenomenon due to the fact that the conductive structure is heated in the case of not reducing the whole thickness of the conductive structure.
申请公布号 WO2016155214(A1) 申请公布日期 2016.10.06
申请号 WO2015CN87879 申请日期 2015.08.24
申请人 BOE TECHNOLOGY GROUP CO., LTD. 发明人 TIAN, Hongwei;MA, Kaihong;XU, Wenqing;ZUO, Yueping;XU, Xiaowei
分类号 H01L23/50;H01L29/41 主分类号 H01L23/50
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