发明名称 SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a technique of improving the productivity of the substrates.SOLUTION: A substrate processing device includes: a substrate placement table provided for at least one of a temperature increase portion or a temperature decrease portion inside a vessel and transmitting heat to and from a substrate placed on the placement surface; and a temperature control unit that controls the temperature of the substrate placement table. When the substrate placement table is provided for the temperature increase portion, the temperature control unit controls the temperature of the substrate placement table to the temperature at which the temperature of the substrate to be delivered into a processing unit can be increased to a predetermined temperature before the substrate is placed on the substrate placement table. When the substrate placement table is provided for the temperature decrease portion, the temperature control unit controls the temperature of the substrate placement table to the temperature at which the temperature of the processed substrate delivered out of the processing unit can be decreased to a predetermined temperature before the substrate is placed on the substrate placement table.SELECTED DRAWING: Figure 1
申请公布号 JP2016184631(A) 申请公布日期 2016.10.20
申请号 JP20150063489 申请日期 2015.03.25
申请人 SUMITOMO CHEMICAL CO LTD 发明人 FUJIKURA HAJIME;KONNO TAICHIRO;NUMATA TAKAYUKI;NEMOTO HIDESATO
分类号 H01L21/205;C23C16/458;C23C16/46;H01L21/31 主分类号 H01L21/205
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