HEAT SINK AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a heat sink, having high heat radiation performance even in natural convection cooling, capable of being downsized.SOLUTION: The heat sink includes a body and a substrate thermally connected to the body. The body is a metal porous body including a three-dimensional network structure of a metallization rate of greater than or equal to 2 vol.% and less than or equal to 15 vol.%.SELECTED DRAWING: None