| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing device in which a debris generated by laser processing can be prevented from being attached to a pattern surface of a plate-like work such as a semiconductor wafer or the like at a low running cost.SOLUTION: A second laser beam irradiation device 32 radiates laser beam 321 in parallel to a top face of a plate-like work 90 which is placed on a work-table 23 and to a predetermined division line. The second laser beam irradiation device 32 radiates the laser beam 321 onto a debris generated by cutting the plate-like work 90 by laser beam 311 radiated by a first laser beam irradiation device 31, thereby evaporating the debris. Since it is not required to cover a surface of the plate-like work with a protection film, running cost relating to laser processing can be reduced. |
