发明名称 PROCESS OF MANUFACTURING LED APPARATUS
摘要 PROBLEM TO BE SOLVED: To solve the problem in which a cutting and separating method capable of obtaining a cross section of a good shape in a short processing time is demanded in a process of manufacturing LED apparatus using a ceramic substrate to which so called an aggregate method is applied.SOLUTION: The process of manufacturing LED apparatus includes: a dividing groove formation step that provides dividing grooves 2a on a rear face of a large-sized substrate 2L; a resin cutting step that cuts a fluorescent resin 4 covering the large-sized substrate 2L with a cutter 5; and a large-sized substrate dividing step that divides the large-sized substrate 2L by pushing the cutter 5 into the large-sized substrate 2L. The resin cutting step and the large-sized substrate dividing step are successively executed.
申请公布号 JP2014165320(A) 申请公布日期 2014.09.08
申请号 JP20130034739 申请日期 2013.02.25
申请人 CITIZEN ELECTRONICS CO LTD;CITIZEN HOLDINGS CO LTD 发明人 TOYAMA HIDEYA;MUTO MITSUKI
分类号 H01L33/48 主分类号 H01L33/48
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