发明名称 |
PROCESS OF MANUFACTURING LED APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To solve the problem in which a cutting and separating method capable of obtaining a cross section of a good shape in a short processing time is demanded in a process of manufacturing LED apparatus using a ceramic substrate to which so called an aggregate method is applied.SOLUTION: The process of manufacturing LED apparatus includes: a dividing groove formation step that provides dividing grooves 2a on a rear face of a large-sized substrate 2L; a resin cutting step that cuts a fluorescent resin 4 covering the large-sized substrate 2L with a cutter 5; and a large-sized substrate dividing step that divides the large-sized substrate 2L by pushing the cutter 5 into the large-sized substrate 2L. The resin cutting step and the large-sized substrate dividing step are successively executed. |
申请公布号 |
JP2014165320(A) |
申请公布日期 |
2014.09.08 |
申请号 |
JP20130034739 |
申请日期 |
2013.02.25 |
申请人 |
CITIZEN ELECTRONICS CO LTD;CITIZEN HOLDINGS CO LTD |
发明人 |
TOYAMA HIDEYA;MUTO MITSUKI |
分类号 |
H01L33/48 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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