发明名称 FLEXIBLE SUBSTRATE DETACHER
摘要 PROBLEM TO BE SOLVED: To provide a flexible substrate detacher capable of easily peeling a flexible substrate from an adhesive sheet without causing breakage or flaw on the substrate. SOLUTION: The adhesive sheet 2 to which the flexible substrate 1 is glued is mounted on a case 3. Compressed air is blown upward from a blower 4 through a blowing port 4a. The compressed air which has been blown out is fed upward through a compressed air passage 3a and a hole 2a and flows out of the upper opening of the hole 2a. The pressure and a flow rate of the compressed air blown out from the blower 4 are then controlled by a pressure/flow rate regulator 5. The compressed air flowing out of the hole 2a enters between the upper surface of the adhesive sheet 2 and the lower surface of the flexible substrate 1. As a result, a void occurs between the substrate 1 and the sheet 2. While the void occurs, the flexible substrate 1 is peeled from the adhesive sheet 2 by means of tweezers. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006156793(A) 申请公布日期 2006.06.15
申请号 JP20040346697 申请日期 2004.11.30
申请人 SUMITOMO METAL MICRO DEVICES INC 发明人 NARUKAWA HIDETAKA
分类号 H01L21/50;H01L21/683 主分类号 H01L21/50
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