发明名称 |
Vertical integration of a MEMS structure with electronics in a hermetically sealed cavity |
摘要 |
A wafer-scale fabrication method for providing MEMS assemblies having a MEMS subassembly sandwiched between and bonded to a cap and a base is provided. The MEMS subassembly includes at least one MEMS device element flexibly connected to the MEMS assembly. The vertical separation between the MEMS device element and an electrode on the base is lithographically defined. Precise control of this critical vertical gap dimension is thereby provided. Fabrication cost is greatly reduced by wafer scale integration.
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申请公布号 |
US2005170656(A1) |
申请公布日期 |
2005.08.04 |
申请号 |
US20040771135 |
申请日期 |
2004.02.02 |
申请人 |
NASIRI STEVEN S.;FLANNERY ANTHONY F.JR. |
发明人 |
NASIRI STEVEN S.;FLANNERY ANTHONY F.JR. |
分类号 |
B81B7/02;H01L21/311;(IPC1-7):H01L21/311 |
主分类号 |
B81B7/02 |
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