发明名称 |
SUBSTRATE FOR FLEXIBLE WIRING BOARD AND FLEXIBLE WIRING BOARD USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a flexible wiring board formed of a copper layer having good buckling resistance, and also to provide a substrate for flexible wiring board. SOLUTION: A double-layer flexible wiring substrate forming the copper layer for wiring includes adequate amount of sulfur and zinc into a copper-plated layer for wiring of the copper layer to form an electric wiring pattern. The copper layer is a plated substrate formed with the plating method. The flexible wiring board is manufactured using such substrate for flexible wiring board. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007220730(A) |
申请公布日期 |
2007.08.30 |
申请号 |
JP20060036744 |
申请日期 |
2006.02.14 |
申请人 |
SUMITOMO METAL MINING CO LTD |
发明人 |
KIBE TATSUO;KASAI KAZUO |
分类号 |
H05K1/09;C22C9/04;C25D7/00;C25D7/06;H05K1/02 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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