发明名称 SUBSTRATE FOR FLEXIBLE WIRING BOARD AND FLEXIBLE WIRING BOARD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a flexible wiring board formed of a copper layer having good buckling resistance, and also to provide a substrate for flexible wiring board. SOLUTION: A double-layer flexible wiring substrate forming the copper layer for wiring includes adequate amount of sulfur and zinc into a copper-plated layer for wiring of the copper layer to form an electric wiring pattern. The copper layer is a plated substrate formed with the plating method. The flexible wiring board is manufactured using such substrate for flexible wiring board. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007220730(A) 申请公布日期 2007.08.30
申请号 JP20060036744 申请日期 2006.02.14
申请人 SUMITOMO METAL MINING CO LTD 发明人 KIBE TATSUO;KASAI KAZUO
分类号 H05K1/09;C22C9/04;C25D7/00;C25D7/06;H05K1/02 主分类号 H05K1/09
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