| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film for a semiconductor having sufficient adhesion to a lead frame, easily released at room temperature from the lead frame or the encapsulating material after encapsulation with an encapsulating material, and used for manufacturing a semiconductor device with high workability, and a lead frame with the adhesive film for the semiconductor, a semiconductor device with the adhesive film for the semiconductor and the semiconductor device each using the adhesive film. SOLUTION: The adhesive film for the semiconductor having a supporting film which is used in such a manner that the adhesive film is adhered to the back face of the lead frame to protect it and peeled off after encapsulation comprises a resin layer A containing a specific compound formed on at least one side of the supporting film wherein the 90 degree peel strength at 25°C between the resin layer A and the lead frame after the adhesive film for the semiconductor is adhered to the lead frame is not less than 5 N/m, and the 90 degree peel strength at 25°C between the resin layer A and the lead frame and the 90 degree peel strength at 25°C between the resin layer A and the encapsulating material after the lead frame to which the adhesive film for the semiconductor is adhered is encapsulated with the encapsulating material are not greater than 1,000 N/m. COPYRIGHT: (C)2008,JPO&INPIT
|
