发明名称 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
摘要 A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.
申请公布号 US2009029630(A1) 申请公布日期 2009.01.29
申请号 US20080232521 申请日期 2008.09.18
申请人 发明人 LIM YOUNG-SAM;LEE DONG-JUN;KIM NAM-SOO;MOON SUNG-TAEK;KANG KYOUNG-MOON;SO JAE-HYUN
分类号 B24B37/00;B24B49/00;B24B37/013;B24B37/04;B24B37/20;B24B37/24;B24B41/06;B24D7/12;C08J5/14;C08L101/00;H01L21/304 主分类号 B24B37/00
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