EPOXY RESIN COMPOSITION, RESIN SHEET, PREPREG, METAL FOIL WITH RESIN, METAL SUBSTRATE AND POWER SEMICONDUCTOR DEVICE

摘要

This epoxy resin composition contains an epoxy resin monomer, a curing agent and a filler. The filler contains a first filler and a second filler. The particle diameter D50 at a cumulative 50% from the small particle diameter side in the weight cumulative particle size distribution curve of the first filler is 20 μm or more, and the first filler contains boron nitride particles having an average aspect ratio ((length in width direction)/(length in thickness direction)) of primary particles of 30 or less or agglomerates of the boron nitride particles. The above-described particle diameter D50 of the second filler is less than 10 μm, and the second filler contains boron nitride particles, the above-described average aspect ratio of which is 5 or less, or agglomerates of the boron nitride particles.