发明名称 プロセス条件測定機器およびその方法
摘要 At least one pair of capacitively coupled electrodes contained in a structure is used to sense the deflection of a diaphragm in a pressure or force sensor for measuring the pressure or force exerted on the diaphragm. Preferably the structure has properties (such as one or more of the following: dimensions, hardness, area and flexibility) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel. For measuring shear force, at least one shear force sensor is used to measure the shear force on a member, when the member is in contact with and pressed against a polishing or planarization surface and a lateral force is applied between the two surfaces. Preferably the structure and the surface of the structure have properties (such as one or more of the following: dimensions and coefficient of friction) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.
申请公布号 JP5964337(B2) 申请公布日期 2016.08.03
申请号 JP20140022564 申请日期 2014.02.07
申请人 ケーエルエー−テンカー コーポレイション 发明人 レンケン・ウェイン・ジー.;サン・メイ・エイチ.;メーソン・アーロン・アブラモウクシ;ウィーゼ・リン・カール
分类号 G01L9/00;B24B37/005;B24B37/04;G01L1/14;H01L21/304 主分类号 G01L9/00
代理机构 代理人
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