| 摘要 |
PROBLEM TO BE SOLVED: To reduce an amount of using gas for control of the atmosphere of a process chamber.SOLUTION: A substrate processing device comprises: a gas supply part (80) for supplying a first gas for atmosphere control, e.g. dry air, into a process chamber (20); a cup-exhausting path (53) for exhausting gas in a cup (50) surrounding a substrate holding part (30) for holding a substrate (W); a process chamber-exhausting path (55) for exhausting gas outside the cup in the process chamber; and a return path (59) for returning the gas outside the cup in the process chamber, exhausted from the process chamber, back into the process chamber. The substrate processing device further comprises an exhaust-switching mechanism (60) for switching between first and second states. In the first state, the gas outside the cup, exhausted from the process chamber, is exhausted from the process chamber-exhausting path, and in the second state, the gas outside the cup, exhausted the process chamber, is returned back into the process chamber through the return path.SELECTED DRAWING: Figure 3 |
