| 摘要 |
PROBLEM TO BE SOLVED: To provide a prober which allows for high accuracy wafer level inspection of high-frequency measurement or dynamic characteristics, while improving the work efficiency and reducing the cost.SOLUTION: A prober includes a wafer chuck 16, a movement and rotation mechanism of the wafer chuck 16, a probe card 24 having a probe 25, a probe position detection camera 18, a wafer alignment camera 19, a camera lifting mechanism 40, a control section 60 for controlling the camera lifting mechanism 40 so that the height at the tip of the probe 25 is the same as the focal position of the wafer alignment camera 19, a stage member 50 having a conductive stage surface 50a connected electrically with the support surface 16a of the wafer chuck 16, and moving integrally with the wafer chuck W, and a conductive contact 70 configured to move integrally with the wafer alignment camera 19, and connecting the chip back electrode electrically with the tester body 31 by coming into contact with the stage surface 50a.SELECTED DRAWING: Figure 1 |
