发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 Semiconductors and methods of manufacturing semiconductors are provided. A semiconductor can include a plurality of insulating layers, and a plurality of conductive layers, with the insulating layers and the conductive layers alternately stacked. A plurality of through electrodes penetrate the conductive layers. At least some the through electrodes are electrically connected to one of the conductive layers. In addition, different conductive layers are connected to different through electrodes. A method of forming a semiconductor structure includes providing a plurality of antifuses, wherein each of the through electrodes is separated from each of the conductive layers by an antifuse. The method further includes supplying at least a first voltage to a first through electrode while applying less than a second voltage to the other electrodes, wherein the first voltage is greater than the second voltage.
申请公布号 WO2016189831(A1) 申请公布日期 2016.12.01
申请号 WO2016JP02430 申请日期 2016.05.18
申请人 SONY SEMICONDUCTOR SOLUTIONS CORPORATION 发明人 SHIIMOTO, Tsunenori
分类号 H01L27/115 主分类号 H01L27/115
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