发明名称 |
CORED SOLDER WIRE WITH ROSIN FLUX AND THERMOSET MATERIAL |
摘要 |
The present disclosure is directed to a solder wire that includes a core having both a rosin flux and a thermoset material. The solder wire being configured to provide an oxide removing rosin flux to an electrical component, a solder alloy to the electrical component, and a protective layer to the solder alloy in a single soldering step. |
申请公布号 |
US2016184938(A1) |
申请公布日期 |
2016.06.30 |
申请号 |
US201414586678 |
申请日期 |
2014.12.30 |
申请人 |
STMICROELECTRONICS PTE LTD |
发明人 |
JIN Yonggang;LIU Yun |
分类号 |
B23K35/36;B23K35/02 |
主分类号 |
B23K35/36 |
代理机构 |
|
代理人 |
|
主权项 |
1. A device, comprising:
a length of solder wire, the wire including:
an exterior solder layer;an interior layer having rosin flux and thermoset material. |
地址 |
Singapore SG |