发明名称 CORED SOLDER WIRE WITH ROSIN FLUX AND THERMOSET MATERIAL
摘要 The present disclosure is directed to a solder wire that includes a core having both a rosin flux and a thermoset material. The solder wire being configured to provide an oxide removing rosin flux to an electrical component, a solder alloy to the electrical component, and a protective layer to the solder alloy in a single soldering step.
申请公布号 US2016184938(A1) 申请公布日期 2016.06.30
申请号 US201414586678 申请日期 2014.12.30
申请人 STMICROELECTRONICS PTE LTD 发明人 JIN Yonggang;LIU Yun
分类号 B23K35/36;B23K35/02 主分类号 B23K35/36
代理机构 代理人
主权项 1. A device, comprising: a length of solder wire, the wire including: an exterior solder layer;an interior layer having rosin flux and thermoset material.
地址 Singapore SG