| 摘要 |
A mounting board manufacturing device is characterized by comprising: a first FPC-side compression bonding unit 51 that performs thermal compression bonding of a first mounted component group 31 including a one-end side mounted component which is, from among a plurality of flexible substrates 13 arranged on an array substrate 11B, a flexible substrate 13 disposed at one end, in the arrangement direction, of the plurality of flexible substrates 13, onto the array substrate 11B by heating as well as pressing the first mounted component group; and a second FPC-side compression bonding unit 52 that is disposed adjacent to the first FPC-side compression bonding unit 51, in the arrangement direction, and that performs thermal compression bonding of a second mounted component group 32 comprising all of the flexible substrates 13 among the plurality of flexible substrates 13 other than the first mounted component group 31, onto the array substrate 11B by heating as well as pressing the second mounted component group. |
