PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD OF CURED RELIEF PATTERN, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which suppresses a residue after development and which is curable at a low temperature and excellent in tensile elongation of a cured film after cured, and to provide a cured film using the photosensitive resin composition, a cured relief pattern forming a pattern and a production method of the relief pattern, and a semiconductor device and a display device having the cured relief pattern.SOLUTION: The photosensitive resin composition comprises the following components (A) to (C). They are: (A) 100 pts.mass of a phenol resin; (B) 0.01 to 20 pts.mass of at least one carboxylic acid or a derivative thereof, selected from the group consisting of monocarboxylic acid compounds having an unsaturated bond and having 3 to 35 carbon atoms and carboxylic acid ester compounds having an unsaturated bond and having 4 to 100 carbon atoms; and (C) 0.1 to 20 pts.mass of a photoacid generator.