发明名称 PROCESS OF MANUFACTURING ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a process of manufacturing an electronic device including a process capable of suppressing excessive etching at a root of a metal pattern containing a metal seed layer at an underlayer.SOLUTION: The process of manufacturing an electronic device includes: forming an initial state seed layer 6 containing metal at an upper part of a ground layer 3; microcrystallizing the metal of the seed layer 6; recrystallizing the metal by annealing the seed layer 6 containing the microcrystallized metal; and forming a metal layer 8 on the annealed seed layer 6 by an electrolytic plating.
申请公布号 JP2014187247(A) 申请公布日期 2014.10.02
申请号 JP20130061679 申请日期 2013.03.25
申请人 FUJITSU LTD 发明人 MORITA MASASHI;IMAIZUMI NOBUHIRO
分类号 H01L21/60;H01L21/3205;H01L21/768;H01L23/522 主分类号 H01L21/60
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