发明名称 |
PROCESS OF MANUFACTURING ELECTRONIC DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a process of manufacturing an electronic device including a process capable of suppressing excessive etching at a root of a metal pattern containing a metal seed layer at an underlayer.SOLUTION: The process of manufacturing an electronic device includes: forming an initial state seed layer 6 containing metal at an upper part of a ground layer 3; microcrystallizing the metal of the seed layer 6; recrystallizing the metal by annealing the seed layer 6 containing the microcrystallized metal; and forming a metal layer 8 on the annealed seed layer 6 by an electrolytic plating. |
申请公布号 |
JP2014187247(A) |
申请公布日期 |
2014.10.02 |
申请号 |
JP20130061679 |
申请日期 |
2013.03.25 |
申请人 |
FUJITSU LTD |
发明人 |
MORITA MASASHI;IMAIZUMI NOBUHIRO |
分类号 |
H01L21/60;H01L21/3205;H01L21/768;H01L23/522 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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