Liquid compression molding encapsulants

摘要

Thermosetting resin compositions useful for liquid compression molding encapsulation of a silicon wafer are provided. The so-encapsulated silicon wafers offer improved resistance to warpage, compared to unencapsulated wafers or wafers encapsulated with known encapsulation materials.

主权项

1. A liquid compression molding curable resin composition, comprising a curable resin matrix, a cure component comprising a cationic catalyst and an oxidant, wherein when cured the composition exhibits a DSC peak below 140° C. and a delta temperature between the onset temperature and the peak on DSC below 20° C.