发明名称 |
Oberflächenmontierbares Multichip-Bauelement |
摘要 |
A surface-mountable multi-chip component includes a carrier having a first connection element, a second connection element and third connection element that are electrically insulated from one another. A first semiconductor chip is arranged on the first connection element and electrically connected to the first and second connection elements. The first connection element forms a first electrode and the second connection element forms a second electrode for the first semiconductor chip. A second semiconductor chip is arranged on the second connection element and electrically connected to the second and third connection elements. The third connection element forms a first electrode and the second connection element forms a second electrode for the second semiconductor chip. The second connection element forms a common cathode or anode for the first and second semiconductor chips during operation. |
申请公布号 |
DE112015000595(A5) |
申请公布日期 |
2016.11.03 |
申请号 |
DE20151100595T |
申请日期 |
2015.01.30 |
申请人 |
OSRAM Opto Semiconductors GmbH |
发明人 |
Morgott, Stefan |
分类号 |
H01L33/62;H01L25/075;H01L33/48 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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