发明名称 |
VERTICAL INDUCTOR FOR WLCSP |
摘要 |
Embodiments of the invention include a microelectronic device and methods of forming a microelectronic device. In an embodiment the microelectronic device includes a semiconductor die and an inductor that is electrically coupled to the semiconductor die. The inductor may include one or more conductive coils that extend away from a surface of the semiconductor die. In an embodiment each conductive coils may include a plurality of traces. For example, a first trace and a third trace may be formed over a first dielectric layer and a second trace may be formed over a second dielectric layer and over a core. A first via through the second dielectric layer may couple the first trace to the second trace, and a second via through the second dielectric layer may couple the second trace to the third trace. |
申请公布号 |
US2016379747(A1) |
申请公布日期 |
2016.12.29 |
申请号 |
US201515036786 |
申请日期 |
2015.06.25 |
申请人 |
MJN U.S. HOLDINGS LLC |
发明人 |
Wolter Andreas;Meyer Thorsten;Knoblinger Gerhard |
分类号 |
H01F27/28;H01F41/04;H01F27/255 |
主分类号 |
H01F27/28 |
代理机构 |
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代理人 |
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主权项 |
1. A microelectronic device, comprising:
a semiconductor die; and an inductor electrically coupled to the semiconductor die, wherein the inductor includes one or more conductive coils that extend away from a surface of the semiconductor die. |
地址 |
Santa Clara CA US |