发明名称 ULTRASONIC MOUNTING TOOL AND MOUNTING APPARATUS FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an ultrasonic mounting tool capable of mounting a bracket without bringing the power loss of ultrasonic vibrations induced on the horn. SOLUTION: The tool comprises a transducer 23 connected to one end of a horn 22 for vibrating the horn; an ultrasonic tool unit 25 for holding a semiconductor chip provided on an underside where the vibration is maximum; a load support 26 projected at a corresponding position to the tool on the upside of the horn; a bracket 27 which butts a lengthwise middle of the underside to the load support and connects and fixes the lengthwise ends, to a portion where the vibration is minimum to transmit the load to the tool unit through the load support when pressing the semiconductor chip; and a hollow 29 disposed in portions between the ends of the bracket and the middle butted to the load support having each a lower rigidity than other portions, enough to be bent and deformed to block the part butted to the load support of the bracket from being bent and deformed when the ends of the bracket are connected and fixed to the horn. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006156813(A) 申请公布日期 2006.06.15
申请号 JP20040347069 申请日期 2004.11.30
申请人 SHIBAURA MECHATRONICS CORP;ESB KK 发明人 UEHARA SADATO;HASHIMOTO MASANORI;HERAI MASAYASU
分类号 H01L21/60;H01L21/607 主分类号 H01L21/60
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