| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation plate exhibiting high heat dissipation effect when an electronic component is mounted while ensuring insulation. SOLUTION: The method for manufacturing a heat dissipation plate comprises a step for laminating an insulating kneaded matter 1 of inorganic fillers 1b, 1c and a thermosetting resin 1a and a metal plate 2 in vacuum. Consequently, bonding strength is enhanced and heat from a heat generating electronic component can be transmitted efficiently to the metal plate 2 through the kneaded matter 1 and dissipated. COPYRIGHT: (C)2006,JPO&NCIPI
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