MATERIAL FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHOD OF MANUFACTURING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a material for printed wiring board in which the quality of boring can be inspected easily because light in the visible region does not transmit from a part other than a through hole after boring, and to provide a printed wiring board having high conduction reliability by forming a through hole well using that material for printed wiring board, and to provide its manufacturing method. SOLUTION: On the opposite surfaces of a hard insulation layer 2 formed by curing a thermosetting resin and not softening in the temperature range of 100-400°C, an adhesive resin layer 3 becoming fusible temporarily in that temperature range and a protective film 4 are arranged in this order and integrated to produce a material 1 for printed wiring board wherein at least one of the hard insulation layer 2, the adhesive resin layer 3 and the protective film 4 does not transmit light. COPYRIGHT: (C)2006,JPO&NCIPI