SUB-MOUNT AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a high-performance sub-mount which can prevent characteristic failure of an electronic element or breakage thereof, and can effectively radiate a heat generating in the electronic device to the outside. SOLUTION: The sub-mount is provided with a wiring layer 3 on the upper surface of an insulating substrate 2, and a pillar-like metallic body 7 is formed in a manner that it vertically penetrates the wiring layer 3. Its one end projects upward from the upper surface of the wiring layer 3, and the other end enters the inside of the insulating substrate 2. COPYRIGHT: (C)2006,JPO&NCIPI