| 摘要 |
A method and arrangement for managing the temperature of an electronic component. A reservoir holds a tempering liquid. A pressurizing device pressurizes the liquid, and provides the liquid to a spraying device, which sprays the liquid onto the electronic component. A heat remover cools the liquid when thermal energy is to be removed from the component, and a heating device heats the liquid when thermal energy is to be provided to the component when powering up the component in low temperatures. |
