| 摘要 |
A method of preventing metal corrosion in metal etching and cleaning processes is provided to improve the reliability of a semiconductor device by preventing the metal corrosion. A deionized water remains on a wafer when a wafer is rinsed by using a deionized water in a rinse process, and a moisture removing process is added to remove the deionized water remaining on the wafer during a period between the rinse process and a dry process, thereby preventing metal corrosion due to the deionized water temporarily remaining at the dry process. In the moisture removing process, the wafer is rinsed by using an isopropyl alcohol rinse solution(119), in which the wafer is immersed in a bath filled with the solution.
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