| 发明名称 |
Packaged Microchip with Patterned Interposer |
| 摘要 |
A packaged microchip has a base, a die with a mounting surface, and an electrically inactive interposer between the base and the die. The interposer has a first side with at least one recess that extends no more than part-way through the interposer from the first side. Accordingly, the recess defines a top portion (of the first side) with a top area. The die mounting surface, which is coupled with the interposer, correspondingly has a die area. The top area of the interposer preferably is less than the die area. |
| 申请公布号 |
US2016229689(A1) |
申请公布日期 |
2016.08.11 |
| 申请号 |
US201615004252 |
申请日期 |
2016.01.22 |
| 申请人 |
Analog Devices, Inc. |
发明人 |
Kaanta Bradley C.;Alberghini John A.;Jia Kemiao |
| 分类号 |
B81B7/00;B81C1/00 |
主分类号 |
B81B7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A packaged microchip comprising:
a base; a die having a mounting surface; an electrically inactive interposer between the base and the die, the interposer having a first side with at least one recess, the first side having a top portion with a top area, the at least one recess extending no more than part-way through the interposer from the first side, the mounting surface of the die being coupled with the interposer, the mounting surface having a die area, the top area being less than the die area. |
| 地址 |
Norwood MA US |
