| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrolytic plating apparatus that can supply a plated product having good quality by reducing the variation of deposition thickness of an electrolytic plating metal layer in a plating bath.SOLUTION: An electrolytic plating apparatus A comprises: a rectangular frame-shaped conductive frame 1 that has an upper side, a lower side, a right side, and a lower side arranged to surround an outer periphery of a rectangular plate-shaped object to be plated P erected vertically, and electrically connects and fixes an upper end and a lower end of the object to be plated P to the upper side and lower side, respectively; and power supply parts 3 which are connected to the conductive frame 1 and receive supply of electric charges from a rectifier. The power supply parts 3 are respectively connected to intermediate points between upper ends and lower ends of the left side and the right side.SELECTED DRAWING: Figure 2 |
