| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive composition for a flexible printed circuit board having excellent flexibility, folding endurance life and adhesivity in a high- temperature environment. SOLUTION: This adhesive composition for a flexible printed circuit board is composed of a bisphenol-type epoxy resin having an epoxy equivalent of <=1,000, a novolak epoxy resin, a butadiene rubber having glycidyl group in the molecular chain other than the molecular terminal, a bisphenol-type epoxy resin or phenoxy resin having a weight-average molecular weight of >=10,000, an epoxy resin curing agent, a cure accelerator, an inorganic filler and a solvent.
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