发明名称 ANISOTROPIC CONDUCTIVE ADHESIVE
摘要 PROBLEM TO BE SOLVED: To obtain a heat curing type anisotropic conductive adhesive capable of carrying out a connection in an electric connection of mutual fine circuits such as a connection between LCD and TCP, a connection between TCP and PCB, especially at a low temperature in a short time, having excellent adhesiveness, connection reliability, preservation stability and repair properties. SOLUTION: This anisotropic conductive adhesive comprises a radically polymerizable resin (A), an organic peroxide (B), a polyvinyl butyral resin (C) as a thermoplastic elastomer, a phosphoric ester and (D) a conductive particle (E) dispersed into a resin composition composed of the components A to D. The anisotropic conductive adhesive comprises also an epoxysilane coupling agent (F) in the resin composition.
申请公布号 JP2001323233(A) 申请公布日期 2001.11.22
申请号 JP20000141157 申请日期 2000.05.15
申请人 SUMITOMO BAKELITE CO LTD 发明人 ITO HIROSHI;KAWADA MASAKAZU
分类号 C09J129/14;C09J9/02;H01B1/20;H01B1/22;H01B1/24;(IPC1-7):C09J129/14 主分类号 C09J129/14
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