发明名称 |
Improved techniques for forming electrically blowable fuses on an integrated circuit |
摘要 |
<p>A method for fabricating an electrically blowable fuse on a semiconductor substrate. The method includes forming a fuse portion 102 on the semiconductor substrate. The fuse portion is configured to turn substantially non-conductive when a current exceeding a predefined current level passes through the fuse portion. The method also includes depositing a substantially conformal first layer 302 of dielectric material above the fuse portion and depositing a second layer 304 of dielectric material above the first layer, thereby forming a protrusion of dielectric material above the fuse portion. The second layer being different from the first layer. The method further includes performing chemical-mechanical polish on the protrusion to form an opening through the second layer above the protrusion. There is also included etching, in a substantially isotropic manner, a portion of the first layer through the opening to form a microcavity 502 about the fuse portion. The etching is substantially selective to the second layer and the fuse portion. Additionally, there is included depositing a substantially conformal third layer 606 of dielectric material above the second layer, thereby closing the opening in the second layer. <IMAGE></p> |
申请公布号 |
EP0903784(A3) |
申请公布日期 |
2005.03.23 |
申请号 |
EP19980112434 |
申请日期 |
1998.07.04 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
WEIGAND, PETER;TOBBEN, DIRK |
分类号 |
H01L27/04;H01L21/82;H01L21/822;H01L23/525;(IPC1-7):H01L23/525 |
主分类号 |
H01L27/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|