| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To directly package a solar cell glass substrate to a printed-wiring board by using conductive paste and an insulating adhesive without packaging any solar cell modules. <P>SOLUTION: Electrical connection is made via the conductive paste 5 between solar cell glass substrate electrodes 3a, 3b and a land 8 that is the electrode of the printed-wiring board 7, an insulating adhesive 6 is applied between the solar cell protective film 4 and the printed-wiring board 7 for sticking and achieving mechanical strength, thus achieving the reliable solar cell module at low manufacturing costs, or a product or a kit using the solar cell. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
