| 摘要 |
PROBLEM TO BE SOLVED: To provide a phase-changing heat dissipating member that has low thermal resistance and excellent workability, and is suitable for a heat dissipation material of an electronic component. SOLUTION: The phase-changing heat dissipating member comprises a metal layer with a Vickers hardness of not more than 24 Hv laminated on at least one surface of a layer formed of a thermo-conductive resin composition containing an organic component of 15-35 percentages by mass including resin softening at 30-120°C and an inorganic filler of 65-90 percentages by mass including powder (a) with an average grain size of 0.3-0.8μm and a powder (b) with an average grain size of 0.9-1.9μm having a volume ratio of a/b=7/3 to 3/7. Also, each powder (a), (b) is an aluminum nitride, and/or alumina powder, and/or zinc oxide powder. Furthermore, the metal layer is tin, indium, or an alloy including at least one of tin and indium. COPYRIGHT: (C)2010,JPO&INPIT |
