发明名称 JET SOLDERING DEVICE, AND SYSTEM OF MANUFACTURING PRINTED BOARD WITH THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a jet soldering device capable of changing the position of a jet nozzle to be variable of soldering width, and at the same time of soldering a target work using a plurality of devices for multi-type versatility and productivity. SOLUTION: A jet solder attaching means 7 has a jet nozzle 21 which can change jet width, depending on the size of a soldered point of a work W to be soldered. A plurality of jet solder attaching means 7 is movably mounted on a soldering part 4 within a predetermined range, depending on the soldered point of the work W, respectively. The jet nozzle 21 has a nozzle hole 21h with a flat hole shape which is turnably adjusted, to match with the soldering width of the soldered point of the work W. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010021356(A) 申请公布日期 2010.01.28
申请号 JP20080180398 申请日期 2008.07.10
申请人 DENSO CORP 发明人 OSAWA TAKUYA;MITSUHARU MASAKI
分类号 H05K3/34;B23K1/00;B23K1/08;B23K101/42 主分类号 H05K3/34
代理机构 代理人
主权项
地址
您可能感兴趣的专利