| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing apparatus and a laser processing method, capable of efficiently collecting debris occurring at laser processing, for removing it from a work piece.SOLUTION: A laser processing apparatus includes a holding means for holding a work piece, a laser beam radiation means which contains a laser beam oscillation means, and a process head containing a condenser lens for focusing laser beam oscillated by the laser beam oscillation means, for radiating the laser beam to the work piece held by the holding means, and a debris collecting means which contains a sucking path in which a passage hole through which the laser beam that is condensed by the condenser lens and focused on the work piece passes is formed, extending in symmetrical manner about the passage hole, and a sucking source to which one end and the other end of the sucking path are respectively and selectively connected, for collecting debris occurring when the laser beam condensed by the condenser lens is radiated to the work piece. |
