| 发明名称 |
LEAD-FREE NANO SOLDER OF CONTROLLABLE MELTING POINT |
| 摘要 |
Leed-free nano-solder includes nanoparticles made of Argentums (Ag) satisfying the following formula. The formula is shown as follows: 3.417+6.3(T_E-491.73)/252.56 <=C_E<=3.63+6.69 (T_E-496.668)/255.09. T_E is process temperature and C_E is Ag (wt%). |
| 申请公布号 |
KR20140127107(A) |
申请公布日期 |
2014.11.03 |
| 申请号 |
KR20130045715 |
申请日期 |
2013.04.24 |
| 申请人 |
KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION |
发明人 |
LEE, JOON HO;SIM, KI JOO |
| 分类号 |
B23K35/30;C22C5/06 |
主分类号 |
B23K35/30 |
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