发明名称 |
Tuning Strain in Semiconductor Devices |
摘要 |
A Fin Field-Effect Transistor (FinFET) includes a semiconductor layer over a substrate, wherein the semiconductor layer forms a channel of the FinFET. A first silicon germanium oxide layer is over the substrate, wherein the first silicon germanium oxide layer has a first germanium percentage. A second silicon germanium oxide layer is over the first silicon germanium oxide layer. The second silicon germanium oxide layer has a second germanium percentage greater than the first germanium percentage. A gate dielectric is on sidewalls and a top surface of the semiconductor layer. A gate electrode is over the gate dielectric. |
申请公布号 |
US2016336445(A1) |
申请公布日期 |
2016.11.17 |
申请号 |
US201615220700 |
申请日期 |
2016.07.27 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Colinge Jean-Pierre;Ching Kuo-Cheng;Chang Gwan Sin;Wu Zhiqiang;Wang Chih-Hao;Diaz Carlos H. |
分类号 |
H01L29/78;H01L21/306;H01L29/66;H01L29/06;H01L29/165 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
1. A device comprising:
a semiconductor substrate; isolation regions extending into the semiconductor substrate; and a Fin Field-Effect Transistor (FinFET) comprising:
a semiconductor layer over the semiconductor substrate, wherein the semiconductor layer forms a channel of the FinFET, and the semiconductor layer is higher than top surfaces of the isolation regions;a silicon germanium oxide layer over the semiconductor substrate and under the semiconductor layer, wherein a portion of the silicon germanium oxide layer extends between opposite portions of the isolation regions, and extends below top surfaces of the isolation regions;a gate dielectric on sidewalls and a top surface of the semiconductor layer; anda gate electrode over the gate dielectric. |
地址 |
Hsin-Chu TW |