| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure for an electronic component with a lead capable of suppressing a load that is applied to the lead when an external force acts, without impairing effects of blow hole suppression even if a resin of a lead insertion component is softened by heat during soldering.SOLUTION: In the mounting structure, a lead 11 of a lead insertion component 10 is inserted into a through-hole 26 that is provided in a base material 15 of a printed circuit board, immersed in a molten solder and soldered. An air-vent tunnel 18 is formed from a surface-mounting component 13 and a surface-mounting component pad 14. As an entrance/exit of the air-vent tunnel 18, a groove 19 is provided in a solder resist 16. Since the air-vent tunnel 18 is not brought into direct contact with the lead insertion component 10, even if a resin of the lead insertion component 10 is softened by soldering, the air-vent tunnel is not closed, such that effects of blow hole suppression are not impaired.SELECTED DRAWING: Figure 3 |
